Taiwan’s TSMC raises $3.5 bln in bonds for brand new U.S. plant

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The brand of Taiwan Semiconductor Production Co (TSMC) is pictured at its headquarters, in Hsinchu, Taiwan, January 19, 2021. REUTERS/Ann Wang

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TAIPEI, April 20 (Reuters) – Taiwanese chip company TSMC (2330.TW), has raised $3.5 billon in bonds for its new plant within the U.S. state of Arizona, in keeping with a time period sheet.

Taiwan Semiconductor Production Co Ltd, a significant Apple Inc (AAPL.O) provider and the arena’s greatest contract chip-maker, began development closing yr on the Arizona website the place it plans to spend $12 billion to construct a pc chip manufacturing facility. learn extra

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Reporting through Ben Blanchard; Further reporting through Scott Murdoch in Sydney
Enhancing through Shri Navaratnam

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